Numerical Simulation of Warhead Penetrating into Multi-Layer Spaced Target ALIVH multilayer printed Board 用数值模拟法研究战斗部侵彻多层间隔靶层间全内导通多层印制板
Test method of steam/ oxygen accelerated ageing of printed board GB/T4677.14-1988印制板蒸汽-氧气加速老化试验方法
Improvement of Multilayer Printed Board Quality by Relieving Residual Hot-pressing Stress 层压板热压释放残余应力对多层印制板品质的改善
A display module mainly comprises a display panel, a printed circuit board and a flexible construction unit. 一种显示模块,其主要包括显示面板、印刷电路板以及软性构装单元。
A new technology of leaching gold out of printed circuit board was studied in this paper. 本文研究了一种从废印刷线路板中提金的新方法。
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex. 多层印制板的制作是一个生产工序复杂且周期很长的过程,那么造成金属化孔镀层空洞的原因也就很复杂。
Routing the connections on a printed circuit board is a complex and time consuming activity. 路由器运行的印刷电路板是一个复杂和耗时的活动。
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning. 本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
A replaceable printed circuit board. 一种可替换的印制电路板。
The utility model is composed of a double-hole panel, screws and a printed board with elements, and a second distributer circuit is adopted. 本实用新型是由双孔面板、带元件的印制板和螺钉构成,采用的是二分配器电路。
The electrolytic copper foil production for printed circuit board in the world has experienced almost fifty years. 印制电路板用电解铜箔产品在世界上已经历了近五十年的发展历程。
The fancy piece of green woven glass and copper with SATA and power connectors called Printed Circuit Board or PCB. 织的绿色玻璃和SATA和电源连接器铜花式一块称为印制电路板或PCB。
The paper studies this pin technology and covers the analysis of printed circuit board strain and process parameters optimization. 文章以该插针工艺为研究主体,涵盖了线路板应力分析和工艺参数的优化过程。
Development of ambient cure fluoropolymer paint applied on antenna of printed board 印制版天线用常温固化氟碳涂料的研制
The Welding of Printed Board& On Teaching Handwork Welding Techniques 印制板焊接&手工焊接技术教学
Ipbds: an integrated printed board design system 集成印制电路板设计系统IPBDS
Vibration Analysis for Military Printed Board Assembly 军用印制板组装件振动分析
Rising reliability of printed board assembly 提高印制板电气装联的可靠性
Integrated printed board design system IPBDS can implement the process from schematic capture to layout IPBDS is concurrent, and support hierarchical design. 本文描述一个在微型计算机上实现的集成印制电路板设计系统IPBDS。
S: Performance and composition of ambient cure fluoropolymer paint applied on antenna of printed board are introduced. Influence of fluoropolymer resin, cure r and additives to film performance is emphasized. 介绍了印制版天线用氟碳涂料的性能要求及其组成,重点讨论了氟碳树脂、固化剂和助剂对涂膜性能的影响,并用红外光谱手段对氟碳涂料的常温固化进行了跟踪。
This article provide an method to control and improve warpage of multilayer printed board by control laminating technol-ogy. 本文从多层板层压工艺控制入手,提出了控制或改善多层板翘曲度的方法。
A heating element is designed using resistance heating silk and printed board, and an instrument of temperature measurement and control is designed using transistor as the temperature sensor. Their working principles and applications in physics experiment are introduced. 介绍利用电阻加热丝、印制基板材料设计制做的加热元件和用晶体管作温度传感器设计制做温度测量控制器的电路工作原理及其在物理实验中的应用。
The paper introduces the composition and control technology of surface mount manufacturing system of electronic circuit module of printed board, the research status and development of trends were accounted. 介绍印制板级电子电路模块表面组装生产系统的组成与控制技术,并对其技术的研究现状和发展动态进行了阐述。
Introduced the characteristics and new increasing function about latest circuit engineering design Protel 99 With a practical example, explained in detail how directly to generate printed board files ( PCB) from schematic diagram files ( SCH) and several using skills 介绍了最新推出的电路工程设计Protel99的特点和新增功能,结合一个应用实例详细讲解如何从原理图(SCH)文件直接生成印制板(PCB)文件,以及若干使用技巧
Research on Transmission Characteristic of Printed Board Trace 印制线的传输特性研究
A new post-treatment technics on electrolytic copper foil used for printed board was studied, including electroplating Zn-Ni based ternary alloy, chromate passivation, dipping for organic film. 研究了一种新的印制板用电解铜箔后处理工艺,依次进行电镀Zn-Ni基三元合金、铬酸盐钝化、浸有机膜等。
Optimum of Technology Parameters about Lamination of Flexible Multilayer Printed Board with Orthogonal Experiment 用正交试验法优化挠性多层板层压工艺参数
A post-treatment technics on electrolytic copper foil used for printed board 印制板用电解铜箔后处理工艺的研究